Master Course
Description
No: EE486
Title: FUNDAMENTALS OF
INTEGRATED CIRCUIT TECHNOLOGY
Credits: 3
UW Course Catalog
Description
Coordinator: Martin A.
Afromowitz, Professor, Electrical Engineering
Goals: To develop a
working knowledge of the methods of integrated circuit fabrication.
Learning
Objectives: At the end of this course, students will be able to:
1. Design and analyze a
process sequence for manufacture of microelectronic chips.
2. Understand the
physical and chemical bases for the common IC processes.
3. Explain how the
limitations of the materials and fabrication methods lead to limitations in
device characteristics.
Textbook: S. Wolf, Microchip Manufacturing, Lattice Press.
Reference: None
Prerequisites by
Topic: An introduction to semiconductor devices and materials.
Topics:
1. Overview; Elements of
IC's (Chap. 1-4)
2. Semiconductor
Substrates (Chap. 9-10)
3. Impurity Diffusion
(Chap. 11)
4. Thermal Oxidation of
Silicon (Chap. 13)
5. Ion Implantation
(Chap. 12)
6. Lithography (Chap.
18-20)
7. Vacuum Technology
(Chap. 6)
8. Evaporation (Chap. 7,
15)
9. Plasma Processing
(Chap. 14)
10. Etching (Chap. 21-22)
11. Chemical Vapor Deposition (Chap. 16)
12. Epitaxy
(Chap. 17)
13. Process Integration
14. Material and Device Characterization
Course
Structure: The class meets on Tuesdays and Thursdays for a 75-minute period.
There is a weekly homework assignment, two midterm exams and a final.
Laboratory
Resources: None
Grading: Course grading
will be based upon homework (20%), the midterm exams (20% each) and the final
(40%).
Outcome
Coverage:
(a) An ability to apply
knowledge of mathematics, science, and engineering. In
almost every lecture, math, science and engineering knowledge will be developed
in the student. This includes detailed discussion of the physics, chemistry and
technology of silicon planar processing and its mathematical simulation. The
homework and exams will test various aspects of the math, science and
engineering knowledge developed by the students.
(M)
(c)
An ability to design a system, component or process to meet desired
needs within realistic constraints such as economic, environmental, social,
political, ethical health and safety, manufacturability and sustainability. Homework
assignments include process design problems in which the students design
partial and complete process sequences for the fabrication of simple silicon
devices with specified characteristics within strict manufacturability
guidelines. Overall, design issues will be discussed in about 25% of the
lectures and will contribute to about 25% of the final grade.
(H)
(e)
An ability to identify, formulate and solve engineering problems. The
homework problems challenge the students to identify engineering problems that
evolve from a high-level design objective, and to formulate a methodology for
achieving success, and ultimately to solve the problem.
(M)
(h)
The broad education necessary to see the impact of engineering
solutions in a global, economic, environmental and societal context. Semiconductor
chips have become pervasive in almost every product we buy, ranging from
talking infant's toys to the cars we drive. In reviewing the societal impact of
the increased complexity and lower cost of modern silicon integrated circuits,
we also discuss the potential for future improvements, and consider the changes
that may result from them. (L)
(i)
A recognition of the need for, and an
ability to engage in life-long learning.
The design and fabrication of IC's is one of
the fastest changing engineering fields. We constantly stress the speed of
discovery, and the need for a professional to maintain awareness of new
developments. (L)
(j)
Knowledge of contemporary issues.
The physical limitations inherent in Moore's
Law and proposed new device structures are discussed.
(L)
(k)
An ability to use the techniques, skills and modern engineering tools
necessary for engineering practice. The computer simulations of processing
sequences exemplify the use of modern engineering software tools for analysis
of complex physical processes. Students devise a time-step integration method
for analyzing diffusion of impurities with non-constant diffusion coefficients.
This exercise anticipates the methods that are used in professional process
simulation software. (M)
Prepared By: Martin A.
Afromowitz
Last Revised: 12/4/12