| Course name | Electronic Packaging and Materials |
| Course number | ME485 Cross listings: MSE485, EE400 |
| Credit Hours | 3 |
| Quarter Offered | Winter |
| Frequency | annually |
| Prerequisites | Required: ENGR215, ENGR170, ENGR220, or equivalent Recommended: - |
| Course Description | The governing equations of transport phenomena: mechanical, thermal, and electromagnetic behavior, thermomechanical and electromagnetic properties of packaging materials, electromagnetic characteristics of circuit and transmission lines, thermal management and reliability analysis of packaging, interconnect and material processing technology. |
| Laboratory | optional, offered as ME/MSE498, EE400 |
| Keywords | Electronic Packaging, Design, Materials, Process, Reliability |
| Web Page | swhite.me.washington.edu/~taya/me485 |
| Contact | Name: Minoru Taya Department: Mechanical Engineering email: taya@me.washington.edu |
This course is part of the curriculum in Applied Microtechnology at the University of Washington.