|Course name||Electronic Packaging Laboratory|
Cross listings: MSE498, EE400
|Prerequisites||Required: ENGR215, ENGR170, ENGR220, or equivalent; ME/MSE485
|Course Description||Lab 1: Dissection of Electronic Packaging.
Investigate the structure and function of electronic packaging.
Lab 2: Processing of Electronic Packaging. Assemble a simple chip on board package. Lab 3: Reliability Testing of Electronic Packaging. View the effects of temperature and moisture on plastic encapsulated packaging.
|Laboratory||Lab offered concurrently with ME/MSE485, EE400|
|Keywords||Electronic Packaging, Design, Materials, Process, Reliability|
|Contact||Name: Minoru Taya
Department: Mechanical Engineering
This course is part of the curriculum in Applied Microtechnology at the University of Washington.