| Course name | Electronic Packaging Laboratory |
| Course number | ME498 Cross listings: MSE498, EE400 |
| Credit Hours | 1 |
| Quarter Offered | Winter |
| Frequency | annually |
| Prerequisites | Required: ENGR215, ENGR170, ENGR220, or equivalent; ME/MSE485 Recommended: - |
| Course Description | Lab 1: Dissection of Electronic Packaging.
Investigate the structure and function of electronic packaging. Lab 2: Processing of Electronic Packaging. Assemble a simple chip on board package. Lab 3: Reliability Testing of Electronic Packaging. View the effects of temperature and moisture on plastic encapsulated packaging. |
| Laboratory | Lab offered concurrently with ME/MSE485, EE400 |
| Keywords | Electronic Packaging, Design, Materials, Process, Reliability |
| Web Page | swhite.me.washington.edu/~taya/me485 |
| Contact | Name: Minoru Taya Department: Mechanical Engineering email: taya@me.washington.edu |
This course is part of the curriculum in Applied Microtechnology at the University of Washington.