This is a built-in wet bench
and fume hood combination that is reserved for
MOS-grade silicon wafer processing. It is used for
wafer cleaning, HF-based oxide etching, and oxide
stripping.
SPECIFICATIONS
MATERIALS
Plastic ware tanks for
etching. Fluoropolymer plastic ware is used for HF
and BOE etching processes.
ONLY substrates containing
Si, O, and N are allowed at this bench. No metals
are allowed. Only CMOS-grade chemicals are allowed.