Photoresist Spin Coater

Specialty Coating Systems Model P6204 

This instrument precisely spins a circular substrate wafer to uniformly spread out a coating of photoresist. The substrate is held by a vacuum chuck while a motor spins the substrate and chuck at speeds of between 1000 and 8000 rpm.

SPECIFICATIONS
MATERIALS

Spin speeds are 1000 to 8000 rpm. Acceleration and deceleration are adjustable; spin time is set to nearest second using thumbwheel switches. Various chuck sizes are available to accommodate wafer diameters from 1 cm up to 6 inches.

Only positive photoresist is allowed. Other spinners will be made available for photoresist development and for spinning on organic films such as polyimides and epoxies.

STATUS
LOCATION
ACCESS CONTACT
TECHNICAL CONTACT

Operational

EE/CSE B017; EE MFL Photolithography Room

R. B. Darling
R. B. Darling