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This instrument precisely spins a circular substrate wafer to uniformly spread out a coating of photoresist. The substrate is held by a vacuum chuck while a motor spins the substrate and chuck at speeds of between 1000 and 8000 rpm. |
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Spin speeds are 1000 to 8000 rpm. Acceleration and deceleration are adjustable; spin time is set to nearest second using thumbwheel switches. Various chuck sizes are available to accommodate wafer diameters from 1 cm up to 6 inches. |
Only positive photoresist is allowed. Other spinners will be made available for photoresist development and for spinning on organic films such as polyimides and epoxies. |
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Operational |
EE/CSE B017; EE MFL Photolithography Room |
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