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This equipment deposits thin films of inorganic materials by means of resistance heating and evaporation inside a high vacuum chamber. Typical deposition rates are 10 nm/min. |
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Three filament connections that are plug selectable. Has quartz lamp substrate heaters and Inficon XMS-3 deposition monitor. Has tooling for one 3-inch wafer and inserts for smaller wafer sizes. CVC CV-18 vacuum chamber, AST-100 low energy sputtering power supply, AST-200 dielectric RF sputtering power supply, LC-031 high-voltage power supply |
Allowed deposition materials are Cr, Au, Al, Ag, Ni, Sn, and In. Allowed substrates are Si, glass, GaAs, metals and metal alloys. Source support materials are W, Ta, Mo, and Al2O3 coated dimple boats. |
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Operational |
EE/CSE B029; EE MFL Processing Room |
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