Current Projects:

1. CoSMoS: Coupled Modeling and Simulation of Systems-on-Chips
   Sponsor: DARPA
   PIs: Richard Shi, Vikram Jandhyala, David Allstot
   Subcontractors: Lawrence Livermore National Lab., Boeing
   Period: July 1, 2001 to June 30, 2004
   Industry Collaborators: Motorola, Intel
   Objectives: a coupled hierarchical modeling and fast simulation capacities for systems-on-chip signoff simulation with the emphasis on predicting substrate coupling and full-wave power-ground noises Target Applications: multiple transceivers on chips
   

2. NSF CAREER: Behavioral Modeling and Simulation
   Sponsor: NSF
   PIs: Richard Shi
   Period: July 1, 2001 to June 30, 2004
   Objectives: Methods and algorithms for automatic behavioral modeling and simulation
   

3. Symbolic Circuit Analysis and Modeling of Analog/RF Circuits
   Sponsor: DARPA
   PIs: Richard Shi
   Period: July 1, 2001 to June 30, 2004
   Industry Collaborators: Motorola, Intel
   Objectives: Symbolic analysis of analog/RF circuits Target Applications: analog/RF circuit block modeling
   

4. Application of Communication Theory to Nano Interconnect Modeling
   Sponsor: NSF/SRC
   PIs: Richard Shi, Sumit Roy and David Allstot
   Period: July 1, 2001 to June 30, 2004
   Objectives: To develop models, based on communication principles for interconnects on a noise environment, and to apply developed models to on-chip signaling.
   

5. Modeling for SoC Integration
   Sponsor: NSF
   PIs: Richard Shi (PI, David Allstot)
   Period: July 1, 2001 to June 30, 2004
   Objectives: Create behavioral models for analog/RF blocks
   

6. Fast Methods for Coupled Circuit/EM/Digital Simulation
   Sponsor: NSF/SRC
   PIs: Richard Shi and Vikram Jandhyala
   Period: July 1, 2001 to June 30, 2004
   Objectives: Methods and algorithms for fast simulation of coupled EM, circuit-level and logic-level models
   

Completed Projects:

1. Layout-Dependent Substrate Modeling via Symbolic Network Reduction (SRC)

2. Application of Communication Principles to Nano-Interconnect Research (NSF)

3. Behavioral Modeling and Simulation for Mixed-Signal/Mixed-Technology Systems (NSF CAREER)

4. Modeling, Simulation and Optimization of Deep-Submicron Interconnect for Performance and Manufacturability (UW)

5. AWECAD: A Web-enabled Environment for Collaborative Analysis and Design of Mixed-Signal/Mixed-Technology Systems (NASA, UW)

6. Symbolic Analysis and Automated Modeling of Analog Integrated Circuits (DARPA, Rockwell)

7. Circuit Simulation and Characterization Considering Process Variations (DARPA)

8. Deep-Submicron Analog Layout Automation through Automating Design Reuse for Performance and Manufacturability (CDADIC, DARPA)

9. Distributed and Parallel Simulation of VLSI Circuits and Systems including Mixed-Technology Components (DARPA)

10. Fault Modeling, Simulation and Test Generation for Mixed-Signal Circuits (DARPA)

11. Mixed-Signal Hardware Description Language VHDL-AMS (DARPA)