Compact Models for Power Semiconductor Devices

Latest update: April 20, 2000

Many power semiconductor device models were developed at the University of Washington through a research program supported by NSF-CDADIC (NSF Center for Design of Analog-Digital Integrated Circuits) during the period from 1990 through1998. MSEE and Ph.D. students under the direction of Professor Peter O. Lauritzen developed most of the models. Almost all of these models are now in the public domain, and they are available for public downloading of model source code and documentation. Several newer and updated models have been added from other universities.  NSF-CDADIC provided a small grant in 1999 to support the inital preparation of this Web page.

Three of the models were developed with partial support from Siemens AG (now Infineon) and one with partial support from EPRI (Electric Power Research Institute). Students at the Indian Institute of Technology, Madras, India also developed some models as a result of P. O. Lauritzen's visit there as a Fulbright Senior Lecturer in 1997.

The models are for discrete and integrated circuit power semiconductor devices and related models. The Vertical Power MOSFET model included in the table is the only model that is currently proprietary. This model is available only to CDADIC firms until it becomes public domain in September 2000. Newly added models are labeled in red.

All of the models are currently implemented in Saber MAST HDL (Hardware Description Language) for use on the Saber simulator available from Analogy, Inc. Compiled models are not available. The models can be translated into VHDL-AMS HDL, the new IEEE Standard Analog HDL or other HDLs for use on other simulators. Information on the possibilities for model support or translation into a standard HDL is available.

These models are being made available to the general public without restrictions to promote their widespread use.  Published model equations and source code is essential so models can be easily understood and be installed on a variety of different simulators. With source code available, users can also assist in identifying and fixing bugs in the models. Please send information on bugs and bug fixes to Peter O. Lauritzen so that they can be incorporated into the public models.

Table of Available Models and Their Characteristics

Model Type
Performance Rating
Quality
Classification
Current
Availability
Diode Models      
Diode with reverse recovery
Basic
3B
YES
Diode with forward and reverse recovery
Basic
3B
YES
Diode, voltage-dependent reverse recovery
Intermediate
1B
YES
Power diode with forward and reverse recovery
Accurate
2B
YES
Electro-thermal power Diode
Thermal
2B
YES
Avalanche and tunneling breakdown
Accurate
1B
Some additional revisions needed
Power BJT Model      
BJT with static and dynamic saturation.
Accurate
1B
YES
Power MOSFET Models      
LDMOS for Smart Power IC design
Accurate
2B
YES
Parasitic BJT for LDMOS
Intermediate
1B
YES
VDMOS for discrete power MOSFETs
Accurate
2B
Proprietary to CDADIC firms until September 2000
IGBT Models      
Punch-through IGBT
Accurate
1B
Withdrawn; will be soon replaced by a new model
Non-punch-through IGBT
Accurate
1B
Withdrawn due to errors in model
Thyristor Models      
SCR/GTO, simple physical-empirical model
Basic
2B
NEWLY REVISED
Triac, simple physical-empirical model
Basic
1B
Still conceptual, not yet implemented
Diac, simple physical-empirical model
Basic
2B
YES
SCR with dynamic charge storage effects.
Accurate
1A
Commercial model also available in Saber
GTO with dynamic charge storage effects.
Accurate
1A
Commercial model also available in Saber

Key to Model Performance Ratings

Basic Simple equation set with easy parameter extraction and fast simulation time. A maximum of one system variable is allowed in a model to keep simulation time fast.
Intermediate Basic model with some additional features to increase accuracy.
Accurate High accuracy, but with slower simulation time and more difficult parameter extraction.
Thermal An Accurate model with additional capability to generate dynamic device temperature and thermal characteristics from internal power dissipation and heat sink characteristics

Key to Model Quality Classifications


1
Model developed as student project without much testing or debugging. .
2
Model debugged and matched against extensive experimental data
3
Some productization has been completed to make the model robust.
A
Parameter extraction procedures are NOT available
B
Parameter extraction procedures ARE available