Research > Faculty Projects

Package Optimization Based on Hierarchical EM-Circuit Simulation and Hierarchical Response Surface Models

Principal Investigator
Vikram Jandhyala

Sponsor(s)
Intel Corporation

Award Period
10/15/2007 - 10/14/2010

Abstract
In emerging package technologies, high-frequency effects, material behavior, and nanosale miniaturization results in non-intuitive and difficult to predict behavior of critical package-level parameters such as return loss and crosstalk. State of the art approaches to this problem are still focused on modeling (very often only approximate) whereas the real issue is optimization and design for desired levels of crosstalk and return loss.

We address the issue of package and package-component optimization and design in the context of fast electromagnetic solvers previously developed by us. The planned technologies are also compatible with existing commercial EM tools but their real power is based on the large-scale design capability that is permitted through their integration with an underlying fast EM-circuit solver.

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