UWEE Tech Report Series

DESIGN AND CONSTRUCTION OF A REFLOW SOLDERING OVEN


UWEETR-2006-0010

Author(s):
Solomon C. Gebre, Keith Eric Johnson, William Josh Russell, Clement Sug-Jay Sun

Keywords:
Reflow Soldering, Temperature Control, Toaster Oven, Capstone Design

Abstract

A low-cost consumer toaster oven has been modified with a digital temperature controller, profile generation software, and a graphical user interface for use in soldering surface mount devices on printed circuit boards. A standard ramp-presoak-reflow-cooldown temperature profile is included by default and temperatures and dwell times can be modified by the user. Temperature tracking performance is very good and several circuit boards have been soldered with the device. Quality of the solder joints appears to be comparable to comercially made boards. This report describes a Senior Capstone Design project in EE449, Design of Control Systems. This project won the EE Department "Best Capstone Design Project" award for Spring 2006.

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