New Projects

  • JCATI: An Optical Tranceiver using 65nm process with CMOS Technology
    Sponsor: State of Washington
    PIs: Richard Shi
    Period: Feb 08, 2013 to Jun 30, 2013
    Objectives: The purpose of this project is to enable use of low cost and light weight plastic fiber based optical communications in airplane avionics communications backplanes. This is part of the Joint Center for Aerospace Technology Innovation.

Recently Completed Projects

  • CASCADE: A 40Gbps Low-Density Parity-Check Decoder ASIC in 3-Dimensional Integrated Circuit Technology
    Sponsor: DARPA and SPAWAR
    PIs: Richard Shi
    Period: Spe 30, 2005 to Sep 29, 2009
    Collaborators: MIT Lincon Lab
    Objectives: To design, implement and test a 40Gbps LDPC communication decoder using emering three-dimensional (multiple layers of transistors) technologies. The research focuses are on the development of structured 3D design methodologies, design flow and CAD tools to enable 3D ASIC design and the demonstration of the potential of fine-grained 3D device interconnect technologies in extending Moore's Law.

  • CoSMoS: Coupled Modeling and Simulation of Systems-on-Chips
    Sponsor: DARPA
    PIs: Richard Shi, Vikram Jandhyala, David Allstot
    Subcontractors: Lawrence Livermore National Lab., Boeing
    Period: July 1, 2001 to June 30, 2004
    Industry Collaborators: Motorola, Intel
    Objectives: a coupled hierarchical modeling and fast simulation capacities for systems-on-chip signoff simulation with the emphasis on predicting substrate coupling and full-wave power-ground noises Target Applications: multiple transceivers on chips

  • NSF CAREER: Behavioral Modeling and Simulation
    Sponsor: NSF
    PIs: Richard Shi
    Period: July 1, 2001 to June 30, 2004
    Objectives: Methods and algorithms for automatic behavioral modeling and simulation

  • Symbolic Circuit Analysis and Modeling of Analog/RF Circuits
    Sponsor: DARPA
    PIs: Richard Shi
    Period: July 1, 2001 to June 30, 2004
    Industry Collaborators: Motorola, Intel
    Objectives: Symbolic analysis of analog/RF circuits Target Applications: analog/RF circuit block modeling

  • Application of Communication Theory to Nano Interconnect Modeling
    Sponsor: NSF/SRC
    PIs: Richard Shi, Sumit Roy and David Allstot
    Period: July 1, 2001 to June 30, 2004
    Objectives: To develop models, based on communication principles for interconnects on a noise environment, and to apply developed models to on-chip signaling.

  • Modeling for SoC Integration
    Sponsor: NSF
    PIs: Richard Shi (PI, David Allstot)
    Period: July 1, 2001 to June 30, 2004
    Objectives: Create behavioral models for analog/RF blocks

  • Fast Methods for Coupled Circuit/EM/Digital Simulation
    Sponsor: NSF/SRC
    PIs: Richard Shi and Vikram Jandhyala
    Period: July 1, 2001 to June 30, 2004
    Objectives: Methods and algorithms for fast simulation of coupled EM, circuit-level and logic-level model


Completed Projects

  • Layout-Dependent Substrate Modeling via Symbolic Network Reduction (SRC)

  • Application of Communication Principles to Nano-Interconnect Research (NSF)

  • Behavioral Modeling and Simulation for Mixed-Signal/Mixed-Technology Systems (NSF CAREER)

  • Modeling, Simulation and Optimization of Deep-Submicron Interconnect for Performance and Manufacturability (UW)

  • AWECAD: A Web-enabled Environment for Collaborative Analysis and Design of Mixed-Signal/Mixed-Technology Systems (NASA, UW)

  • Symbolic Analysis and Automated Modeling of Analog Integrated Circuits (DARPA, Rockwell)

  • Circuit Simulation and Characterization Considering Process Variations (DARPA)

  • Deep-Submicron Analog Layout Automation through Automating Design Reuse for Performance and Manufacturability (CDADIC, DARPA)

  • Distributed and Parallel Simulation of VLSI Circuits and Systems including Mixed-Technology Components (DARPA)

  • Fault Modeling, Simulation and Test Generation for Mixed-Signal Circuits (DARPA)

  • Mixed-Signal Hardware Description Language VHDL-AMS (DARPA)

 

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